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重藤 暁津
Address
305-0044 茨城県つくば市並木1-1 [アクセス]
  • 論文・発表

[研究論文] |[書籍] |[会議録] |[口頭発表] |[特許]

研究論文 TSV

2018
  1. SHIGETOU, Akitsu, Naomi Namiki. 次世代パワー半導体用接合技術の動向(章内 4P). YANO E Plus. 118 [1] (2018) 73-76
2016
  1. 重藤 暁津, 梶原 優介. 新しい機能性表面/界面創製のツールとしての低温大気圧ハイブリッド接合技術. エレクトロニクス実装学会誌. 19 [2] (2016) 120-126 10.5104/jiep.19.120
  2. SHIGETOU, Akitsu. 低温大気圧による有機無機材料ハイブリッド化. ケミカルエンジニヤリング. 61 [4] (2016) 287-293
  3. Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou. Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectronics Reliability. 59 (2016) 134-139 10.1016/j.microrel.2015.12.033
  4. Go Yamada, SHIGETOU, Akitsu. 真空紫外光を用いた高分子材料の直接接合. 接着学会誌. 52 [4] (2016) 101-106
2014
  1. Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Akitsu Shigetou. Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI. IEEE Transactions on Components, Packaging and Manufacturing Technology. 4 [5] (2014) 762-768 10.1109/tcpmt.2014.2311094
2013
  1. Akiko Okada, Shuichi Shoji, Masatsugu Nimura, Akitsu Shigetou, Katsuyuki Sakuma, Jun Mizuno. Vacuum Ultraviolet Irradiation Treatment for Reducing Gold–Gold Bonding Temperature. MATERIALS TRANSACTIONS. 54 [11] (2013) 2139-2143 10.2320/matertrans.mf201313
  2. SHIGETOU, Akitsu. ハイブリッド材料創製のツールとしての接合技術. PEN NEWS LETTER. Web [9] (2013) 99999-99999
  3. Masatsugu Nimura, Jun Mizuno, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Shuichi Shoji. Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration. IEEE Transactions on Components, Packaging and Manufacturing Technology. 3 [4] (2013) 558-565 10.1109/tcpmt.2013.2240566
2012
  1. SHIGETOU, Akitsu, Other: 26 authors. 3次元システムインパッケージと材料技術:第16章 3次元SiPのためのバンプレスインタコネクト. 3次元システムインパッケージと材料技術. (2012) 179-190
  2. Akitsu Shigetou, Tadatomo Suga. Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure. Journal of Electronic Materials. 41 [8] (2012) 2274-2280 10.1007/s11664-012-2091-9
  3. SHIGETOU, Akitsu, Jun Mizuno, Kiyokazu Yasuda. Eco-friendly bonding technologies for hybrid integration. 表面実装技術. [8月号] (2012) 60-65
  4. Environmentally Friendly Packaging Technology for a Sustainable Future. Journal of Japan Institute of Electronics Packaging. 15 [1] (2012) 29-33 10.5104/jiep.15.29
  5. Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga. Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding. Microelectronics Reliability. 52 [2] (2012) 342-346 10.1016/j.microrel.2010.12.006
2009
  1. SHIGETOU, Akitsu, Tadatomo Suga. Modified Diffusion Bonding of Chemical Mechanical Polishing (CMP)-Cu at 150C at Ambient Pressure. APPLIED PHYSICS EXPRESS. 2 [5] (2009) 056501-1-056501-3
  2. SHIGETOU, Akitsu. 表面改質を用いた接合技術による低温での材料複合化. エレクトロニクス実装学会誌. 12 [1] (2009) 34-38
2008
  1. A. Shigetou, T. Itoh, K. Sawada, T. Suga. Bumpless Interconnect of 6-$\mu$m-Pitch Cu Electrodes at Room Temperature. IEEE Transactions on Advanced Packaging. 31 [3] (2008) 473-478 10.1109/tadvp.2008.920644
  2. Masamitsu Aoki, Yasumitsu Tanaka, Yasuhiro Yoneda, Akinao Yano, Isao Tsukakoshi, SHIGETOU, Akitsu, Hideomi Hayashi, 安食弘二, Akimitsu Omori, Masami Honda, HOSODA, Naoe. 環境調和型実装技術に関する現状と展望. エレクトロニクス実装学会誌. 11 [1] (2008) 36-42
2007
  1. SHIGETOU, Akitsu. 3次元SiPのためのバンプレスインタコネクト. 3次元システムインパッケージと材料技術. (2007) 179-189

会議録 TSV

2018
  1. SHIGETOU, Akitsu, Hongwei Yang, Robert Kao. Low Temperature and Non-Vacuum Surface Modification for Robust Hybrid Bonding. Proc. SSDM 2018. 2018, 459-460
  2. SHIGETOU, Akitsu, Hong Wei Yang, Robert Kao. 高信頼性低温大気圧有機無機ハイブ リッド接合. マイクロエレクトロニクスシンポジウム(MES)講演論文集. 2018, 265-268
2016
  1. SHIGETOU, Akitsu. 高機能なハイブリッド界面創製のための低温大気圧表面改質技術. はんだ・微細接合部会シンポジウム IoT時代のものをつなぐ技術. 2016, 41-45
  2. Fu Weixing, Shuichi Shoji, Jun MIzuno, SHIGETOU, Akitsu. Low Temperature Bonding Between Polyether Ether Ketone (PEEK) and Pt Through Vapor Assisted VUV Surface Modification. Proc. IEEE ECTC. 2016, 2541-2546
  3. Weixin Fu, SHIGETOU, Akitsu, Syuichi Shoji, Jun Mizuno. Low Temperature direct Bonding of PEEK and Pt through VUV/FAB Surface Treatments. Proc. ICEP 2016. 2016, 302-306
2015
  1. SHIGETOU, Akitsu, Jun Mizuno, Syuichi Shoji. Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Tempe. Proc. ICEP 2015. 2015, 239-242
  2. Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuich Shoji, Mamoru Tamura, Tomoyuki Enomoto, SHIGETOU, Akitsu. Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron Pitch. Proc. 2015 ECTC. 2015, 325-330
  3. Masatsugu Nimura, Masaki Ohyama, Shuichi Shoji, M. Tamura, T. Enomoto, SHIGETOU, Akitsu, Jun Mizuno. 3D Interconnection of Single Micron Pitch by Hybrid Bonding Technology. Proc. SSDM. 2015, 788-789
  4. SHIGETOU, Akitsu, Jun Mizuno, Syuichi Shoji. Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Tempe. Proc. 2015 ECTC. 2015, 1498-1501
2014
  1. Masaki Ohyama, Jun Mizuno, Syuichi Shoji, Masatsugu Nimura, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, SHIGETOU, Akitsu. Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration. Proc. ICEP2014. 2014, 604-607
  2. SHIGETOU, Akitsu, AJAYAN, Mano, Jun Mizuno, Syuichi Shoji. Vacuum Ultraviolet (VUV) / Vapor-Assisted Bonding for Organic / Inorganic Hybrid Integration. Proc. SSDM 2014. 2014, 42-43
  3. AJAYAN, Mano, SHIGETOU, Akitsu, Jun Mizuno, Syuichi Shoji. Room-Temperature Direct Bonding of Graphene Films by Means of Vacuum Ultraviolet (VUV) / Vapor-Assisted Method. ICEP2014 Proceedings. 2014, 652-657
2013
  1. Masatsugu Nimura, Jun Mizuno, SHIGETOU, Akitsu, Katsuyuki Sakuma, Tomoyuki Enomoto, Hiroshi Ogino, Shuichi Shoji. Hybrid Au-Au Bonding Technology using Planar Adhesive Structure for 3D Integration. Proc. IEEE 2013 Electronic Components & Technology Conference. 2013, 1153-1157
  2. Akiko Okada, Masatsugu NImura, SHIGETOU, Akitsu, Katsuyuki Sakuma, Jun Mizuno, Syuichi Shoji. VUV/O3 Treatment for Reduction of Au-Au Bonding Temperature. Proc. ICEP 2013. 2013, 289-293
  3. Takashi Matsumae, Masahisa Fujino, SHIGETOU, Akitsu, Yoshiie Matsumoto, Tadatomo Suga. 中間層を用いた表面活性化手法によるポリマー/ポリマーおよびポリマー/ガラス常温接合. エレクトロニクス実装学会講演論文集. 2013, 13F06-145-13F06-148
  4. Takashi Matsumae, Masahisa Fujino, SHIGETOU, Akitsu, Yoshiie Matsumoto, Tadatomo Suga. Room Temperature Bonding of Polymer/Polymer and Polymer/Glass using modified Surface Activation Bonding Method. Peoc. ICEP 2013. 2013, 70-73
  5. AJAYAN, Mano, SHIGETOU, Akitsu, Jun Mizuno, Syuichi Shoji. Graphene-graphene room temperature direct bonding by using VUV/vapor-assisted at atmospheric pressure. Proc. WaferBond 2013. 2013, 23-24
  6. SHIGETOU, Akitsu, AJAYAN, Mano, Jun Mizuno. 真空紫外光照射を利用した金属,樹脂基板の大気圧混載接合. エレクトロニクス実装学会春期講演大会論文集. 2013, PR0086-1-PR0086-3
  7. SHIGETOU, Akitsu, AJAYAN, Mano, Jun Mizuno. VUV-Assisted Low Temperature Bonding For Organic/Inorganic Hybrid Integration at Atmospheric Pressure. Proc. IEEE CPMT Symposium Japan 2013. 2013, 040-1-040-4
  8. SHIGETOU, Akitsu, AJAYAN, Mano, Jun Mizuno. VUV-assisted hybrid bonding of organic/inorganic substrate at atmospheric pressure. Proc. ICEP 2013. 2013, 51-54
2012
  1. SHIGETOU, Akitsu. UV/Vapor-Assisted表面改質による 透明有機/無機基板の低温大気圧接合 . 第196回有機エレクトロニクス材料研究会論文集. 2012, 9-11
  2. SHIGETOU, Akitsu, Tadatomo Suga. Vapor-assisted hybrid bonding of inorganic/organic substrates for 3D hetero-integration. Proceedings of 3rd IEEE int'l Workshop on Low Temperature Bonding for 3D Integration. 2012, 59-65
  3. SHIGETOU, Akitsu. Low Temperature Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure. Proc. of 2012 IMAPS symposium. 2012, 000497-000502
  4. Masatsugu Nimura, SHIGETOU, Akitsu, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto. Hybrid Au-Underfill Resin Bonding with Lock-and-Key Structure. Proceedings of 62nd Electronics Components and Technology Conference. 2012, 258-262
  5. Masatsugu Nimura, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomono, SHIGETOU, Akitsu, Syuichi Shoji, Jun MIzuno. Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI. Proceedings of 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration. 2012, 81-83
  6. Akiko Okada, Masatsugu Nimura, SHIGETOU, Akitsu, Hirokazu Noma, Katsuyuki Sakuma, Syuichi Shoji, Jun Mizuno. Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration. Proceedings of 3rd IEEE int'l Workshop on Low Temperature Bonding for 3D Integration. 2012, 171-173
  7. SHIGETOU, Akitsu, Tadatomo Suga. Hybrid Bonding of Organic/Inorganic Substrates in Ambient Air for Eco-Friendly 3D Integration of Microelectronics. Proc. of EGG 2012. 2012, 184-189
  8. SHIGETOU, Akitsu, AJAYAN, Mano, Jun Mizuno, Tadatomo Suga. UV/Vapor-Assisted Hybrid Bonding Technology as a Tool for Future Nanopackaging. Proc. IEEE NANO 2012. 2012, 1708-1712
2011
  1. SHIGETOU, Akitsu, Tadatomo Suga. Homo/Heterogeneous Bonding of Cu, SiO2, and Polyimide by Low Temperature Vapor- Assisted Surface Activation Method. Proceedings of 61st Electronic Components and Technology Conference. 2011, 32-36
  2. Naoko Unami, H. Noma, K. Sakuma, SHIGETOU, Akitsu, S. Shoji, Jun Mizuno. Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment. Proceedings of APM2011. 2011, 220-225
  3. SHIGETOU, Akitsu. 有機/無機基板混載のための接合技術. 有機エレクトロニクス材料研究会 190回研究会. 2011, 7-10
2010
  1. Matiar Howlader, Hiroyuki Shintani, Tadatomo Suga, SHIGETOU, Akitsu, Akira Yamauchi. Development of a New SAB Equipment for Room Temperature Bonding. Proceedings of the LTB-3D. 2010, 469-470
  2. Tadatomo Suga, SHIGETOU, Akitsu. Surface Activated Bonding - An Overview and Cu Direct Bonding. Proceedings of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration. 2010, 1-2
  3. SHIGETOU, Akitsu. Low Temperature Bonding Technology in Ambient Air for 3D Hetero Integration of Mixed Substrates. New trends in nanomaterials design and engineering. 2010, 1-5
  4. Tadatomo Suga, Hiroyuki Shintani, Matiar Howlader, sawada kanako, SHIGETOU, Akitsu, Akira Yamauchi. 高精度高真空接合装置の開発. 第24回エレクトロニクス実装学会講演大会論文集. 2010, 222-223
  5. SHIGETOU, Akitsu, T. Suga. Vapor-Assisted Low Temperature Bonding Method for Cu and SiO2. Proceedings of Electronics System Integration Technology Conferences (ESTC) 2010. 2010, 9999-9999
  6. SHIGETOU, Akitsu, Tadatomo Suga. Modified Diffusion Bonding for Both Cu and SiO2 at 150 。・ in Ambient Air. Proceedings of 60th Electronic Components and Technology Conference. 2010, 872-877
2009
  1. SHIGETOU, Akitsu, Tadatomo Suga. Direct interconnection of chemical mechanical polishing (CMP)-Cu thin films at 150C in ambient air. European Microelectronics and Packaging Conference 2009 Proceedings. 2009, 1-5
  2. SHIGETOU, Akitsu, Tadatomo Suga. 表面改質を適用したCuならびにSiO2の低温大気圧接合. 第23回エレクトロニクス実装学会講演大会講演論文集. 2009, 209-210
  3. SHIGETOU, Akitsu, Tadatomo Suga. Modified Diffusion Bond Process for Chemical Mechanical Polishing (CMP)-Cu at 150。・ in Ambient Air. Electronic Components and Technology Conference, 2009. ECTC. 2009, 365-369
2008
  1. SHIGETOU, Akitsu, SUGA Tadatomo. Ultrafine Pitch Cu Interconnection by Bumpless Structure. Technical Digest of International 3D System Integration Conference 2008. 2008, 395-396
  2. SHIGETOU, Akitsu, SUGA, Tadatomo. Low Temperature Bonding of CMP-Cu in Humidified Oxygen Gas at Ambient Air Pressure. Proceedings of the 2008 ICEP. 2008, 9999-9999
  3. SHIGETOU, Akitsu, Toshihiro Itoh, Kanako Sawada, SUGA Tadatomo. Bumplee Interconnect of 6-um-pitch Cu Electrodes at Room Temperature. The 58th Electronic Components and Technology Conference. 2008, 1405-1409
  4. SHIGETOU, Akitsu, Tadatomo Suga. Modified Diffusion Bonding of CMP-Cu Films at 150 C in Ambient Air. The 2nd ICMAN. 2008, 1-4
2007
  1. SHIGETOU, Akitsu, Tsuguharu Wakamatsu, Masatake Akaike, Eiji Higurashi, SUGA, Tadatomo. Effect of SAB Process on GaN Surfaces for Low Temperature Bonding. Proceedings of Polytronic 2007. 2007, 16-18

口頭発表 TSV

2019
  1. 邱 于珊, SHIGETOU, Akitsu, C. Robert Kao. Lead-free and Fluxless Indium Solder Bonding Process in Low Temperature through Vacuum ultraviolet (VUV). 11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing. 2019
  2. 重藤 暁津. IoTに向けた軽量ハイブリッドかつスマートな構造材料のための接合技術. 2019修善寺ワークショップ. 2019
  3. Yu-Shan Chiu, SHIGETOU, Akitsu, C. Robert Kao. Low Temperature and Fluxless Bonding Process of Cu-In through VUV. 2019 Taiwan-Japan Workshop on Electronic Interconnection. 2019
  4. SHIGETOU, Akitsu, Tilo H. Yang, Robert Kao, Robert Kao. Hybrid Bonding in Ambient Atmosphere for 3D Integration. The IEEE International 3D Systems Integration Conference (3DIC). 2019
  5. MIYAZAKI, Hideki, MANO, Takaaki, KASAYA, Takeshi, OOSATO, Hirotaka, 渡邉 一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, OCHIAI, Tetsuyuki, ARAI, Yukinaga, SHIGETOU, Akitsu. Metamaterial quantum well infrared photodetectors based on plasmon-enhanced intersubband transition. the 7th International Workshop on Epitaxial Growth and Fundamental Properties of Semiconductor Nanostructures (SemiconNano2019). 2019
  6. MIYAZAKI, Hideki, MANO, Takaaki, KASAYA, Takeshi, OOSATO, Hirotaka, 渡邉 一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, OCHIAI, Tetsuyuki, ARAI, Yukinaga, SHIGETOU, Akitsu. Metasurface Quantum-well Infrared Photodetectors. The Fourth A3 Metamaterials Forum. 2019
  7. SHIGETOU, Akitsu. Inorganic-Organic Low Temperature Hybrid Bonding with Anti-Hydrolysis Interface. The 20th International Conference on Electronic Packaging Technology (ICEPT). 2019
  8. 重藤 暁津. 軽量ハイブリッドかつスマートな構造材料創製のための低温大気圧接合技術. 実装フェスタ関西 2019. 2019
  9. T. H. Yang, C. Y. Yang, SHIGETOU, Akitsu, C. R. Kao. A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process. 2019 International Conference on Electronics Packaging (ICEP). 2019
  10. MINARI, Takeo, LIU, Xu-Ying, SUN, Qingqing, LI, Wanli, SHIGETOU, Akitsu, 金原 正幸. Printing of Flexible Electronics for Wearable Applications. 2019 International Conference on Electronics Packaging. 2019
  11. 重藤 暁津, 楊 弘偉, 高 振宏, 高 振宏. 低温大気圧有機無機ハイブリッド接合に必要な極薄架橋構造の設計. 第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム. 2019
2018
  1. 重藤 暁津, Tilo H Yang, C Robert Kao. 軽量かつスマートな構造材料のための 高信頼性低温大気圧異材接合技術. 第124回マイクロ接合研究委員会. 2018
  2. MIYAZAKI, Hideki, MANO, Takaaki, KASAYA, Takeshi, OOSATO, Hirotaka, Kazuhiro WATANABE, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, ARAI, Yukinaga, SHIGETOU, Akitsu. メタ表面量子井戸赤外線検出器. 2018年第65回応用物理学会春季学術講演会. 2018
  3. SHIGETOU, Akitsu. 異種材料複合化のツールとしての低温大気圧接合技術:原理,開発の現状. 日本学術振興会 プラズマ材料科学第153委員会 スクール 異種材料間. 2018
  4. 重藤暁津. 機能性材料創製のための低温大気圧接合技術 - 要素技術と将来展望 -. 学振153委員会 プラズマ材料科学スクール. 2018
2017
  1. SHIGETOU, Akitsu. Hybrid Bonding Among Polymers, Metals and Semiconductors for Lightweight and Smart Structural Materialss. Materials Science Conference & SMART Center Workshop. 2017
  2. SHIGETOU, Akitsu. 新しい機能性材料創製の”道具”としての ハイブリッド接合. 東レ 専門自主講座. 2017
  3. SHIGETOU, Akitsu. A New Hybrid Bonding Method for 3D Integration. 第2回日仏三次元集積回路の課題と今後の展開に関するワークショップ. 2017
2016
  1. 重藤暁津. 軽量スマート構造材料を指向したハイブリッド接合技術. (社)エレクトロニクス実装学会機能性ハイブリッド材料研究会公開研. 2016
  2. SHIGETOU, Akitsu. Non-Vacuum Low Temperature Hybrid Bonding for Lightweight and Flexible Electronics. IMPACT 2016. 2016
  3. 重藤暁津, 水野 潤, 庄子 習一. 生体親和性エレクトロニクス実装のための低温 大気圧接合技術. JIEP MicroElectronics Sysystem (MES) シンポジウム. 2016
  4. SHIGETOU, Akitsu. 高機能なハイブリッド界面創製のための低温大気圧表面改質技術. (社)スマートプロセス学会 第13回 電子デバイス実装研究委員会. 2016
  5. 重藤暁津. 多様な応用分野開拓のためのハイブリッド接合技術. 日本機械学会 研究協力事業委員会所属分科会 高密度エレクトロニクス. 2016
2013
  1. SHIGETOU, Akitsu. 真空紫外光照射を用いた有機/無機基板材料の大気圧低温混載接合. エレクトロニクス実装学会2013ワークショップ. 2013
  2. SHIGETOU, Akitsu. 有機・無機材料ハイブリッド化のための大気圧低温接合手法. 日立研究所 有機材料研究会. 2013
  3. SHIGETOU, Akitsu. 低温大気圧で実行可能な有機/無機材料のハイブリッド接合. 新学術領域「生物規範工学」全体会議・合同研究会. 2013
  4. SHIGETOU, Akitsu. 大気圧低温接合技術による異種材料ハイブリッド化の展望. (独)日本学術振興会 システムデザイン・インテグレーション第177委. 2013
  5. SHIGETOU, Akitsu. Bonding method in low temperature, atmospheric pressure, and low toxicity conditions for hybrid materials. NIMS/IZM Workshop on Nanotechnology and Environmental Engineerin. 2013
  6. SHIGETOU, Akitsu. 低温・大気圧下の異種材料接合技術に熱い注目,課題は信頼性評価手法の確立. IEEE/CPMT International Conference on Electronics Packaging. 2013
  7. SHIGETOU, Akitsu. 大気圧低温で実行可能な異種材料混載接合手法. エレクトロニクス実装学会 第4回公開研究会 部品内蔵基板の最新技術. 2013
2012
  1. Jun Mizuno, Akiko Okada, Masatsugu Nimura, Naoko Unami, SHIGETOU, Akitsu, Hirokazu Noma, Katsuyuki Sakuma. Study of surface treatment process using VUV/O3 treatment for Au-Au bonding. ISAEM-2012 and AMDI3. 2012
  2. SHIGETOU, Akitsu. Hybrid bonding in ambient air - a feasible tool for mixed integrations. IEEE CPMT Society Evening Meeting. 2012
  3. Naoko Unami, Hirokazu Noma, Katsuyuki Sakuma, SHIGETOU, Akitsu, Shuichi Shoji, Jun Mizuno. Sn-Auフリップチップ接合における界面への真空紫外光およびギ酸を用いたフラックスッレス接合技術の基礎検討. MATE 2012 エレクトロニクスにおけるマイクロ接合・実装技術シンポジ. 2012
2008
  1. SHIGETOU, Akitsu. 表面改質による低温接合技術. NEC 第18回実装技術研究会. 2008
  2. SHIGETOU, Akitsu, Isamu Shoji, SUGA, Tadatomo. Low Temperature Bonding of CMP-Cu in Humidified Oxygen Gas at Ambient Air Pressure. International Conference on Electronics Packaging (ICEP) 2008. 2008
  3. SHIGETOU, Akitsu, Isamu Shoji, SUGA, Tadatomo. CMP-Cu薄膜の低温大気圧接合. 第22回 エレクトロニクス実装学会講演大会. 2008
  4. SHIGETOU, Akitsu. Low-temperature, low-vacuum, and direct Cu interconnections: a novel bonding technology assisted by the chemical surface modification. ICYS Final Workshop 2008. 2008
2007
  1. SHIGETOU, Akitsu. Cuバンプレス電極による超微細直接接続技術. エレクトロニクス実装学会関西ワークショップ. 2007
  2. SHIGETOU, Akitsu, Toshiro Itoh, SUGA, Tadatomo. 高密度実装のためのCu超微細バンプレスインタコネクト. 電子情報通信学会研究会:LSIシステムの実装. 2007
  3. SHIGETOU, Akitsu. Micron-Pitch Direct Bumpless Interconnect of Cu Electrodes. インターネプコン・ジャパン. 2007

特許 TSV

登録特許
  1. 特許第6251935号 接合方法、及び接合装置 (2017)
公開特許出願
  1. 特開2019/221288号 積層体の製造方法、積層体、及び、暖房便座装置 (2019)
  2. 特開2014188536号 金属材の拡散接合方法および金属材の拡散接合装置 (2014)
外国特許

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