HOME > 会議録 > 書誌詳細Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration(超微細Cu/Sn平滑電極と絶縁層の一括接合)Masaki Ohyama, Jun Mizuno, Syuichi Shoji, Masatsugu Nimura, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, SHIGETOU, Akitsu. Proc. ICEP2014 604-607. 2014.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2017-02-27 02:33:26 +0900更新時刻: 2017-03-17 04:45:53 +0900