Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration | SAMURAI, NIMS Researchers Directory Service

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Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration
(超微細Cu/Sn平滑電極と絶縁層の一括接合)

Masaki Ohyama, Jun Mizuno, Syuichi Shoji, Masatsugu Nimura, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, SHIGETOU, Akitsu.

Proc. ICEP2014 604-607. 2014.

NIMS author(s)

SHIGETOU, Akitsu

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2017-02-27 02:33:26 +0900 Updated at: 2017-03-17 04:45:53 +0900

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