HOME > 会議録 > 書誌詳細Vapor-Assisted Low Temperature Bonding Method for Cu and SiO2(バンプレス基板一括低温接続のための水和物架橋接合法)SHIGETOU, Akitsu, T. Suga. Proceedings of Electronics System Integration Technology Conferences (ESTC) 2010 9999-9999. 2010.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2017-02-27 01:55:35 +0900更新時刻: 2017-03-17 04:00:48 +0900
