publication_type publication_year number author title journal_title volume_number issue_number start_page end_page doi reported_at Paper 2022 1 重藤 暁津 次世代の移動体IoTを指向したハイブリッド接合の要素技術 電気学会誌 142 11 708 711 https://doi.org/10.1541/ieejjournal.142.708 2024-03-29 01:51:55 +0900 Paper 2022 2 Akitsu Shigetou, Naoe Hosoda Materials Letters 323 132499 https://doi.org/10.1016/j.matlet.2022.132499 2024-03-29 01:51:55 +0900 Paper 2021 1 Mel F. Hainey, Takaaki Mano, Takeshi Kasaya, Yoji Jimba, Hiroshi Miyazaki, Tetsuyuki Ochiai, Hirotaka Osato, Yoshimasa Sugimoto, Takuya Kawazu, Akitsu Shigetou, Hideki T. Miyazaki メタ表面多重量子井戸検出器でバンド間遷移検出能限界を突破する Optics Express 29 26 43598 https://doi.org/10.1364/oe.444223 2024-03-29 01:51:55 +0900 Paper 2021 2 Mel F. Hainey, Takaaki Mano, Takeshi Kasaya, Yoji Jimba, Hiroshi Miyazaki, Tetsuyuki Ochiai, Hirotaka Osato, Kazuhiro Watanabe, Yoshimasa Sugimoto, Takuya Kawazu, Yukinaga Arai, Akitsu Shigetou, Hideki T. Miyazaki Patchwork metasurface quantum well photodetectors with broadened photoresponse Optics Express 29 1 59 https://doi.org/10.1364/oe.408515 2024-03-29 01:51:55 +0900 Paper 2020 1 Mel F. Hainey, Takaaki Mano, Takeshi Kasaya, Tetsuyuki Ochiai, Hirotaka Osato, Kazuhiro Watanabe, Yoshimasa Sugimoto, Takuya Kawazu, Yukinaga Arai, Akitsu Shigetou, Hideki T. Miyazaki Systematic studies for improving device performance of quantum well infrared stripe photodetectors Nanophotonics 9 10 3373 3384 https://doi.org/10.1515/nanoph-2020-0095 2024-03-29 01:51:55 +0900 Paper 2020 2 Mel F. Hainey, Takaaki Mano, Takeshi Kasaya, Tetsuyuki Ochiai, Hirotaka Osato, Kazuhiro Watanabe, Yoshimasa Sugimoto, Takuya Kawazu, Yukinaga Arai, Akitsu Shigetou, Hideki T. Miyazaki Near-field resonant photon sorting applied: dual-band metasurface quantum well infrared photodetectors for gas sensing Nanophotonics 9 16 4775 4784 https://doi.org/10.1515/nanoph-2020-0456 2024-03-29 01:51:55 +0900 Paper 2020 3 Akitsu SHIGETOU 移動体IoTに必要な高信頼性低温大気圧ハイブリッド接合 Yosetsu Gakkai Shi/Journal of the Japan Welding Society 38 46 2024-03-29 01:51:55 +0900 Paper 2020 4 Hideki T. Miyazaki, Takaaki Mano, Takeshi Kasaya, Hirotaka Osato, Kazuhiro Watanabe, Yoshimasa Sugimoto, Takuya Kawazu, Yukinaga Arai, Akitsu Shigetou, Tetsuyuki Ochiai, Yoji Jimba, Hiroshi Miyazaki Synchronously wired infrared antennas for resonant single-quantum-well photodetection up to room temperature Nature Communications 11 1 https://doi.org/10.1038/s41467-020-14426-6 2024-03-29 01:51:55 +0900 Paper 2020 5 Y.S. Chiu, C.R. Kao, A. Shigetou Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure Materials & Design 195 109065 https://doi.org/10.1016/j.matdes.2020.109065 2024-03-29 01:51:55 +0900 Paper 2019 1 Tilo H. Yang, Yu-Shan Chiu, Ching-Yun Yang, Akitsu Shigetou, C. Robert Kao Polyimide-Polyetheretherketone and Tin-Polyimide Direct Bonding via Ethanol-Assisted Vacuum Ultraviolet Irradiation Transactions of The Japan Institute of Electronics Packaging 12 0 E19 012 https://doi.org/10.5104/jiepeng.12.e19-012-1 2024-03-29 01:51:55 +0900 Paper 2019 2 Tilo H. Yang, C. Robert Kao, Akitsu Shigetou Organic-Inorganic Solid-State Hybridization with Anti-Hydrolysis Ability Scientific Reports 9 1 https://doi.org/10.1038/s41598-018-37052-1 2024-03-29 01:51:55 +0900 Paper 2017 1 Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno Low-temperature direct heterogeneous bonding of polyether ether ketone and platinum Materials Science and Engineering: C 79 860 865 https://doi.org/10.1016/j.msec.2017.05.058 2024-03-29 01:51:55 +0900 Paper 2017 2 Hong-Wei Yang, C. Robert Kao, Akitsu Shigetou Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid Integration Langmuir 33 34 8413 8419 https://doi.org/10.1021/acs.langmuir.7b02010 2024-03-29 01:51:55 +0900 Paper 2017 3 Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno Low temperature direct bonding between PEEK(polyetheretherketone) and Pt via vapor-assisted vacuum ultraviolet surface modificatrion Journal of Materials Science and Engineering B 7 2 https://doi.org/10.17265/2161-6221/2017.3-4.001 2024-03-29 01:51:55 +0900 Paper 2016 1 重藤 暁津, 梶原 優介 新しい機能性表面/界面創製のツールとしての低温大気圧ハイブリッド接合技術 エレクトロニクス実装学会誌 19 2 120 126 https://doi.org/10.5104/jiep.19.120 2024-03-29 01:51:55 +0900 Paper 2016 2 Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection Microelectronics Reliability 59 134 139 https://doi.org/10.1016/j.microrel.2015.12.033 2024-03-29 01:51:55 +0900 Paper 2016 3 山田 剛, 重藤 暁津 真空紫外光を用いた高分子材料の直接接合 接着学会誌 52 4 101 106 2024-03-29 01:51:55 +0900 Paper 2016 4 重藤 暁津 低温大気圧による有機無機材料ハイブリッド化 ケミカルエンジニヤリング 61 4 287 293 2024-03-29 01:51:55 +0900 Paper 2014 1 Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Akitsu Shigetou 平坦密着構造を用いた金-樹脂のハイブリッド接合 IEEE Transactions on Components, Packaging and Manufacturing Technology 4 5 762 768 https://doi.org/10.1109/tcpmt.2014.2311094 2024-03-29 01:51:55 +0900 Paper 2013 1 Akiko Okada, Shuichi Shoji, Masatsugu Nimura, Akitsu Shigetou, Katsuyuki Sakuma, Jun Mizuno Vacuum Ultraviolet Irradiation Treatment for Reducing Gold–Gold Bonding Temperature MATERIALS TRANSACTIONS 54 11 2139 2143 https://doi.org/10.2320/matertrans.mf201313 2024-03-29 01:51:55 +0900 Paper 2013 2 重藤 暁津 ハイブリッド材料創製のツールとしての接合技術 PEN NEWS LETTER Web 9 99999 99999 2024-03-29 01:51:55 +0900 Paper 2013 3 Masatsugu Nimura, Jun Mizuno, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Shuichi Shoji Lock and Key構造を用いた低温バンプレス接合 IEEE Transactions on Components, Packaging and Manufacturing Technology 3 4 558 565 https://doi.org/10.1109/tcpmt.2013.2240566 2024-03-29 01:51:55 +0900 Paper 2012 1 重藤 暁津, 著者:他26名 3次元システムインパッケージと材料技術:第16章 3次元SiPのためのバンプレスインタコネクト 3次元システムインパッケージと材料技術 "" "" 179 190 2024-03-29 01:51:55 +0900 Paper 2012 2 SHIGETOU, Akitsu, Jun Mizuno, Kiyokazu Yasuda 低環境負荷な接合手法による異種材料のハイブリッド化 表面実装技術 "" 8月号 60 65 2024-03-29 01:51:55 +0900 Paper 2012 3 Akitsu Shigetou, Tadatomo Suga 親水性架橋皮膜を用いた銅,ガラス,ポリイミドの低温大気圧混載接合 Journal of Electronic Materials 41 8 2274 2280 https://doi.org/10.1007/s11664-012-2091-9 2024-03-29 01:51:55 +0900 Paper 2012 4 重藤暁津 環境調和型実装技術 - 省エネルギ,新材料,新しい技術 第二部 低環境負荷な接合手法による異種材料のハイブリッド化 Journal of Japan Institute of Electronics Packaging 15 1 29 33 https://doi.org/10.5104/jiep.15.29 2024-03-29 01:51:55 +0900 Paper 2012 5 Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga ナノ密着層を利用したSi, SiNウエハの混載接合 Microelectronics Reliability 52 2 342 346 https://doi.org/10.1016/j.microrel.2010.12.006 2024-03-29 01:51:55 +0900 Paper 2010 1 SHIGETOU, Akitsu 有機材料も含めた異種材料混載接合の可能性 表面実装技術 11 7 52 59 2024-03-29 01:51:55 +0900 Paper 2010 2 重藤 暁津 有機材料も含めた異種材料混載接合の可能性 エレクトロニクス実装学会誌 13 2 107 113 https://doi.org/10.5104/jiep.13.107 2024-03-29 01:51:55 +0900 Paper 2009 1 SHIGETOU, Akitsu, Tadatomo Suga 150℃以下でのCMP-Cu薄膜の大気圧拡散接合 APPLIED PHYSICS EXPRESS 2 5 056501-1 056501-3 2024-03-29 01:51:55 +0900 Paper 2009 2 重藤 暁津 表面改質を用いた接合技術による低温での材料複合化 エレクトロニクス実装学会誌 12 1 34 38 2024-03-29 01:51:55 +0900 Paper 2008 1 A. Shigetou, T. Itoh, K. Sawada, T. Suga 6umピッチ銅電極バンプレスインターコネクト IEEE Transactions on Advanced Packaging 31 3 473 478 https://doi.org/10.1109/tadvp.2008.920644 2024-03-29 01:51:55 +0900 Paper 2008 2 青木正光, 田中泰光, 米田泰博, 矢野昭尚, 塚越功, 重藤 暁津, 林秀臣, 安食弘二, 大森章光, 本田正実, 細田 奈麻絵 環境調和型実装技術に関する現状と展望 エレクトロニクス実装学会誌 11 1 36 42 2024-03-29 01:51:55 +0900