HOME > 論文 > 書誌詳細Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnectionMasaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou. Microelectronics Reliability 59 134-139. 2016.https://doi.org/10.1016/j.microrel.2015.12.033 NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-27 22:12:31 +0900 更新時刻: 2026-09-30 05:44:17 +0900
