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Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou.
Microelectronics Reliability 59 134-139. 2016.
https://doi.org/10.1016/j.microrel.2015.12.033

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