Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration
(Lock and Key構造を用いた低温バンプレス接合)

Masatsugu Nimura, Jun Mizuno, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Shuichi Shoji.

IEEE Transactions on Components, Packaging and Manufacturing Technology 3 [4] 558-565. 2013.

https://doi.org/10.1109/tcpmt.2013.2240566

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作成時刻: 2016-05-24 16:49:48 +0900更新時刻: 2024-04-02 03:19:47 +0900

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