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Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron Pitch

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuich Shoji, Mamoru Tamura, Tomoyuki Enomoto, SHIGETOU, Akitsu.
Proc. 2015 ECTC 325-330. 2015.

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