HOME > 会議録 > 書誌詳細Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron PitchMasaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuich Shoji, Mamoru Tamura, Tomoyuki Enomoto, SHIGETOU, Akitsu. Proc. 2015 ECTC 325-330. 2015.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻 :2017-02-27 02:44:50 +0900 更新時刻 :2017-03-17 04:59:25 +0900