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最終更新時刻: 2026-10-22 04:34:43 +0900
| 2 article(s) found. Sorted by publication dates. (Help) | |
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| SHIGETOU, Akitsu, Jun Mizuno, Syuichi Shoji. Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Tempe. Proc. 2015 ECTC. (2015) 1498-1501 | |
| Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuich Shoji, Mamoru Tamura, Tomoyuki Enomoto, SHIGETOU, Akitsu. Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron Pitch. Proc. 2015 ECTC. (2015) 325-330 | |
