HOME > 論文 > 書誌詳細Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI(平坦密着構造を用いた金-樹脂のハイブリッド接合)Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Akitsu Shigetou. IEEE Transactions on Components, Packaging and Manufacturing Technology 4 [5] 762-768. 2014.https://doi.org/10.1109/tcpmt.2014.2311094 NIMS著者Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 17:10:45 +0900更新時刻: 2024-04-02 04:07:26 +0900
