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Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI
(平坦密着構造を用いた金-樹脂のハイブリッド接合)

Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Akitsu Shigetou.

IEEE Transactions on Components, Packaging and Manufacturing Technology 4 [5] 762-768. 2014.

https://doi.org/10.1109/tcpmt.2014.2311094

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2016-05-24 17:10:45 +0900 Updated at: 2026-10-08 05:55:19 +0900

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