HOME > 会議録 > 書誌詳細Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration(紫外光利用による大気圧低温金電極接合)Akiko Okada, Masatsugu Nimura, SHIGETOU, Akitsu, Hirokazu Noma, Katsuyuki Sakuma, Syuichi Shoji, Jun Mizuno. Proceedings of 3rd IEEE int'l Workshop on Low Temperature Bonding for 3D Integration 171-173. 2012.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2017-02-27 02:14:14 +0900更新時刻: 2017-03-17 04:23:10 +0900
