HOME > 会議録 > 書誌詳細Surface Activated Bonding - An Overview and Cu Direct Bonding(表面活性化常温接合法 - 直接接合法の展望)Tadatomo Suga, SHIGETOU, Akitsu. Proceedings of the 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration 1-2. 2010.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2017-02-27 01:48:34 +0900更新時刻: 2017-03-17 03:52:54 +0900
