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表面改質を適用したCuならびにSiO2の低温大気圧接合
(Modified Diffusion Bonding Process for Cu and SiO2 at Low Temperature in Ambient Air)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-27 01:37:56 +0900 Updated at: 2017-03-17 03:40:37 +0900