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UV/Vapor-Assisted表面改質による 透明有機/無機基板の低温大気圧接合
(Hybrid integration of transparent resin substrate and semiconductors in ambient air)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-27 02:18:22 +0900 Updated at: 2017-03-17 04:28:03 +0900