HOME > Presentation > Detail
Inorganic-Organic Low Temperature Hybrid Bonding with Anti-Hydrolysis Interface
The 20th International Conference on Electronic Packaging Technology (ICEPT). August 12, 2019-August 15, 2019. Invited
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2020-01-10 03:00:27 +0900 Updated at: 2024-03-05 12:21:19 +0900