HOME > 会議録 > 書誌詳細Bumplee Interconnect of 6-um-pitch Cu Electrodes at Room Temperature(常温6ミクロンピッチバンプレス接合)SHIGETOU, Akitsu, Toshihiro Itoh, Kanako Sawada, SUGA Tadatomo. The 58th Electronic Components and Technology Conference 1405-1409. 2008.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2017-02-27 01:25:09 +0900更新時刻: 2017-03-17 03:25:50 +0900
