HOME > Proceedings > DetailUltrafine Pitch Cu Interconnection by Bumpless Structure(Cuバンプレス超微細接続の要素技術(レビュー))SHIGETOU, Akitsu, SUGA Tadatomo. Technical Digest of International 3D System Integration Conference 2008 395-396. 2008.NIMS author(s)SHIGETOU, AkitsuFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2017-02-27 01:28:56 +0900 Updated at: 2017-03-17 03:30:12 +0900