3D Interconnection of Single Micron Pitch by Hybrid Bonding Technology

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Masatsugu Nimura, Masaki Ohyama, Shuichi Shoji, M. Tamura, T. Enomoto, SHIGETOU, Akitsu, Jun Mizuno.

Proc. SSDM 788-789. 2015.

作成時刻: 2017-02-27 02:46:01 +0900更新時刻: 2017-03-17 05:00:48 +0900