HOME > 会議録 > 書誌詳細Modified Diffusion Bonding for Both Cu and SiO2 at 150 ｡・ in Ambient Air(銅とシリコン酸化物に大気圧低温で一括適用可能な接合手法)SHIGETOU, Akitsu, Tadatomo Suga. Proceedings of 60th Electronic Components and Technology Conference 872-877. 2010.NIMS著者重藤 暁津Materials Data Repository (MDR)上の本文・データセット作成時刻: 2017-02-27 01:52:16 +0900更新時刻: 2017-03-17 03:57:07 +0900
