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Modified Diffusion Bonding for Both Cu and SiO2 at 150 ｡・ in Ambient Air
(銅とシリコン酸化物に大気圧低温で一括適用可能な接合手法)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-27 01:52:16 +0900 Updated at: 2017-03-17 03:57:07 +0900