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Last updated: October 21, 2026
| 7 article(s) found. Sorted by publication dates. (Help) | |
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| Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou. Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectronics Reliability. 59 (2016) 134-139 10.1016/j.microrel.2015.12.033 | |
| Barbara Horváth. Influence of copper diffusion on the shape of whiskers grown on bright tin layers. Microelectronics Reliability. 53 [7] (2013) 1009-1020 10.1016/j.microrel.2013.03.008 | |
| Balázs Illés, Barbara Horváth. Whiskering behaviour of immersion tin surface coating. Microelectronics Reliability. 53 [5] (2013) 755-760 10.1016/j.microrel.2013.02.001 | |
| Qinghua Wang, Satoshi Kishimoto, Huimin Xie, Zhanwei Liu, Xinhao Lou. In situ high temperature creep deformation of micro-structure with metal film wire on flexible membrane using geometric phase analysis. Microelectronics Reliability. 53 [4] (2013) 652-657 10.1016/j.microrel.2012.10.016 | |
| Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga. Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding. Microelectronics Reliability. 52 [2] (2012) 342-346 10.1016/j.microrel.2010.12.006 | |
| Huimin Xie, Satoshi Kishimoto, Yanjie Li, Qingjun Liu, Yapu Zhao. Fabrication of micro-moiré gratings on a strain sensor structure for deformation analysis with micro-moiré technique. Microelectronics Reliability. 49 [7] (2009) 727-733 10.1016/j.microrel.2009.04.005 | |
| Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga. Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method. Microelectronics Reliability. 43 [5] (2003) 751-756 10.1016/s0026-2714(03)00039-8 | |
