HOME > 論文 > 書誌詳細Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding methodQian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga. Microelectronics Reliability 43 [5] 751-756. 2003.https://doi.org/10.1016/s0026-2714(03)00039-8 NIMS著者Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 16:32:45 +0900 更新時刻: 2026-10-08 05:21:01 +0900
