HOME > 論文 > 書誌詳細Influence of copper diffusion on the shape of whiskers grown on bright tin layersBarbara Horváth. Microelectronics Reliability 53 [7] 1009-1020. 2013.https://doi.org/10.1016/j.microrel.2013.03.008 NIMS著者Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 17:29:10 +0900 更新時刻: 2026-10-08 05:45:12 +0900
