Nonalloyed Ohmic Contacts to Buried n-GaAs Appearing After Reversed Wafer Transfer Process
International Conference on Solid State Devices and Materials. 2018.
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Materials Data Repository (MDR)上の本文・データセット
作成時刻: 2018-07-14 16:06:32 +0900更新時刻: 2018-07-14 16:06:32 +0900