Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer
(Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström-Thin Passivation Layer)

著者	Yunjo Jeong, Ossie Douglas, Utkarsh Misra, Md Rubayat‐E Tanjil, Kenji Watanabe, Takashi Taniguchi, Michael Cai Wang.
掲載誌名	Advanced Electronic Materials 7 [6] 2100002 ISSN: 2199160X ESIでのカテゴリ: MATERIALS SCIENCE
出版社	Wiley
発表年	2021
言語	English
DOI	https://doi.org/10.1002/aelm.202100002
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Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer(Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström-Thin Passivation Layer)