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AuthorKIM, Keehyun, WATANABE, Makoto, KAWAKITA, Jin, KURODA, Seiji, MITSUISHI, Kazutaka, SHIMIZU, Junya, 榎 学.
Titleウォームスプレーにおける密着の機構
(Bonding Mechanism in Warm Spray Deposition)
Event name日本金属学会2007年秋期大会
Year of publication2007
LanguageJapanese

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