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Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process

NAGATA, Takahiro, Kazumichi Tsumura, Kenro Nakamura, Kengo Uchida, KAWAKITA, Jin, CHIKYO, Toyohiro, Kazuyuki Higashi.
The IEEE International 3D Systems Integration Conference 2019. 2019.

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Materials Data Repository (MDR)上の本文・データセット

    作成時刻: 2019-10-24 03:00:26 +0900更新時刻: 2019-10-24 03:00:26 +0900

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