Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process

HOME > 口頭発表 > 書誌詳細

NAGATA, Takahiro, Kazumichi Tsumura, Kenro Nakamura, Kengo Uchida, KAWAKITA, Jin, CHIKYO, Toyohiro, Kazuyuki Higashi.

The IEEE International 3D Systems Integration Conference 2019. 2019年10月08日-2019年10月10日.

作成時刻: 2019-10-24 03:00:26 +0900 更新時刻: 2019-10-24 03:00:26 +0900