Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining
(六方晶SiCのスライスによるダメージの比較)

Yukari Ishikawa, Yong-Zhao Yao, Yoshihiro Sugawara, Koji Sato, Yoshihiro Okamoto, Noritaka Hayashi, Benjamin Dierre, Kentaro Watanabe, Takashi Sekiguchi.

Japanese Journal of Applied Physics 53 [7] 071301. 2014.

https://doi.org/10.7567/jjap.53.071301

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作成時刻: 2016-05-24 17:14:29 +0900更新時刻: 2024-04-02 03:40:30 +0900

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