六方晶SiCのスライスによるダメージの比較

Yukari Ishikawa; Yong-Zhao Yao; Yoshihiro Sugawara; Koji Sato; Yoshihiro Okamoto; Noritaka Hayashi; Benjamin Dierre; Kentaro Watanabe; Takashi Sekiguchi; Yukari Ishikawa; Yong-Zhao Yao; Yoshihiro Sugawara; Koji Sato; Yoshihiro Okamoto; Noritaka Hayashi; Benjamin Dierre; Kentaro Watanabe; Takashi Sekiguchi

doi:10.7567/jjap.53.071301

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Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining
(六方晶SiCのスライスによるダメージの比較)

Yukari Ishikawa, Yong-Zhao Yao, Yoshihiro Sugawara, Koji Sato, Yoshihiro Okamoto, Noritaka Hayashi, Benjamin Dierre, Kentaro Watanabe, Takashi Sekiguchi.

Japanese Journal of Applied Physics 53 [7] 071301. 2014.

https://doi.org/10.7567/jjap.53.071301

NIMS著者

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2016-05-24 17:14:29 +0900 更新時刻: 2026-11-09 05:30:52 +0900

Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining(六方晶SiCのスライスによるダメージの比較)

NIMS著者

Materials Data Repository (MDR)上の本文・データセット

Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining
(六方晶SiCのスライスによるダメージの比較)