Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining

Yukari Ishikawa; Yong-Zhao Yao; Yoshihiro Sugawara; Koji Sato; Yoshihiro Okamoto; Noritaka Hayashi; Benjamin Dierre; Kentaro Watanabe; Takashi Sekiguchi; Yukari Ishikawa; Yong-Zhao Yao; Yoshihiro Sugawara; Koji Sato; Yoshihiro Okamoto; Noritaka Hayashi; Benjamin Dierre; Kentaro Watanabe; Takashi Sekiguchi

doi:10.7567/jjap.53.071301

Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining
(六方晶SiCのスライスによるダメージの比較)

Yukari Ishikawa, Yong-Zhao Yao, Yoshihiro Sugawara, Koji Sato, Yoshihiro Okamoto, Noritaka Hayashi, Benjamin Dierre, Kentaro Watanabe, Takashi Sekiguchi.

Japanese Journal of Applied Physics 53 [7] 071301. 2014.

https://doi.org/10.7567/jjap.53.071301

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2016-05-24 17:14:29 +0900 Updated at: 2026-11-09 05:30:52 +0900

Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining(六方晶SiCのスライスによるダメージの比較)

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining
(六方晶SiCのスライスによるダメージの比較)