Cu Ion Plating as a technique for enhancing the mechanical, electrical and thermal bonding between Cu stabilizer and RHQT-proces | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Cu Ion Plating as a technique for enhancing the mechanical, electrical and thermal bonding between Cu stabilizer and RHQT-proces
(RHQT法Nb3Al線材とCu安定化材の間における機械的、電気的、熱的接続性の向上のためのCuイオンプレーティング)

KIKUCHI, Akihiro, SAKURAI, Yoshihiro, TAKEUCHI, Takao, KITAGUCHI, Hitoshi, IIJIMA, Yasuo, BANNO, Nobuya, TAGAWA, Kohei, INOUE, Kiyoshi.

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY 3376-3379. 2005.

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作成時刻: 2022-10-21 22:02:22 +0900更新時刻: 2022-10-21 22:02:22 +0900

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