Cu Ion Plating as a technique for enhancing the mechanical, electrical and thermal bonding between Cu stabilizer and RHQT-proces
(RHQT法Nb3Al線材とCu安定化材の間における機械的、電気的、熱的接続性の向上のためのCuイオンプレーティング)
| Author(s) | KIKUCHI, Akihiro, SAKURAI, Yoshihiro, TAKEUCHI, Takao, KITAGUCHI, Hitoshi, IIJIMA, Yasuo, BANNO, Nobuya, TAGAWA, Kohei, INOUE, Kiyoshi. |
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| Journal title | IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY 3376-3379 |
| Publisher | |
| Year of publication | 2005 |
| Language | English |