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最終更新時刻: 2026-10-22 04:34:43 +0900

1 article(s) found. Sorted by publication dates. (Help)
Masatsugu Nimura, Jun Mizuno, SHIGETOU, Akitsu, Katsuyuki Sakuma, Tomoyuki Enomoto, Hiroshi Ogino, Shuichi Shoji. Hybrid Au-Au Bonding Technology using Planar Adhesive Structure for 3D Integration. Proc. IEEE 2013 Electronic Components & Technology Conference. (2013) 1153-1157