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Fast filling of Through-silicon Via (TSV) with Conductive Polymer/metal Composites

KAWAKITA, Jin, HORVATH, Barbara, CHIKYOW, Toyohiro.

Proceedings of 3DIC 2015 3DIC2015-197-3DIC2015-201. 2015.

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2017-02-27 02:46:01 +0900 Updated at: 2017-10-24 22:03:28 +0900

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