HOME > Proceedings > Detail3D Interconnection of Single Micron Pitch by Hybrid Bonding TechnologyMasatsugu Nimura, Masaki Ohyama, Shuichi Shoji, M. Tamura, T. Enomoto, SHIGETOU, Akitsu, Jun Mizuno. Proc. SSDM 788-789. 2015.NIMS author(s)SHIGETOU, AkitsuFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2017-02-27 02:46:01 +0900Updated at: 2017-03-17 05:00:48 +0900