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Solid-State Debonding of Cu-Cu Interface by Cooling
International Conference on Electronics Packaging (ICEP) 2024. April 17, 2024-April 19, 2024. Invited
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2025-02-23 03:12:05 +0900 Updated at: 2025-02-23 03:12:05 +0900