HOME > 論文 > 書誌詳細Cross-sectional analysis of the interface between Sn-Ag-Cu solder alloy and Substrate by using angle lapping methodN. Ishikawa, T. Kimura, T. Sugisaki, S. Tanuma. Journal of Surface Analysis 9 [3] 416-419. 2002.https://doi.org/10.1384/jsa.9.416 NIMS著者石川 信博Materials Data Repository (MDR)上の本文・データセット作成時刻: 2016-05-24 11:52:14 +0900 更新時刻: 2026-09-21 04:13:44 +0900
