In situ via Contact to hBN-Encapsulated Air-Sensitive Atomically Thin Semiconductors
Hae Yeon Lee, Zhiying Wang, Grace Chen, Luke N. Holtzman, Xingzhou Yan, Jacob Amontree, Amirali Zangiabadi, Kenji Watanabe, Takashi Taniguchi, Katayun Barmak, Philip Kim, James C. Hone.
