HOME > Article > DetailRate of Diffusion Creep Accompanied by Grain Boundary Sliding in Elongated Microstructures(伸びた結晶粒組織において粒界すべりを伴う拡散クリープ速度)B.-N. Kim, K. Morita, K. Hiraga. Materials Science and Engineering: A 363 [1-2] 67-71. 2003.https://doi.org/10.1016/s0921-5093(03)00576-8 NIMS author(s)KIM, Byung-NamMORITA, KojiFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2016-05-24 11:59:37 +0900 Updated at: 2026-11-04 06:08:25 +0900