Bumpless Interconnect of 6-μm-pitch Cu Electrodes at Room Temperature
(6umピッチ銅電極バンプレスインターコネクト)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2016-05-24 15:27:42 +0900Updated at: 2024-04-01 23:56:25 +0900