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著者名Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.
タイトルFilling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles
掲載誌名Microelectronic Engineering 97 126-129
ISSN: 01679317
ESIでのカテゴリ: ENGINEERING
出版社Elsevier BV
発表年2012
言語English
DOIhttps://doi.org/10.1016/j.mee.2012.02.031
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