Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles | 研究者総覧SAMURAI - 物質・材料研究機構 (NIMS)

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Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.

Microelectronic Engineering 97 126-129. 2012.

https://doi.org/10.1016/j.mee.2012.02.031

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柴田曉伸

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2020-10-02 09:10:00 +0900 更新時刻: 2026-10-07 05:18:55 +0900

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