HOME > Article > DetailFilling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particlesNao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Microelectronic Engineering 97 126-129. 2012.https://doi.org/10.1016/j.mee.2012.02.031 NIMS author(s)SHIBATA, AkinobuFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2020-10-02 09:10:00 +0900Updated at: 2024-04-02 02:04:18 +0900