Via Method for Lithography Free Contact and Preservation of 2D Materials
Evan J. Telford, Avishai Benyamini, Daniel Rhodes, Da Wang, Younghun Jung, Amirali Zangiabadi, Kenji Watanabe, Takashi Taniguchi, Shuang Jia, Katayun Barmak, Abhay N. Pasupathy, Cory R. Dean, James Hone.