Via Method for Lithography Free Contact and Preservation of 2D Materials

Evan J. Telford; Avishai Benyamini; Daniel Rhodes; Da Wang; Younghun Jung; Amirali Zangiabadi; Kenji Watanabe; Takashi Taniguchi; Shuang Jia; Katayun Barmak; Abhay N. Pasupathy; Cory R. Dean; James Hone; Evan J. Telford; Avishai Benyamini; Daniel Rhodes; Da Wang; Younghun Jung; Amirali Zangiabadi; Kenji Watanabe; Takashi Taniguchi; Shuang Jia; Katayun Barmak; Abhay N. Pasupathy; Cory R. Dean; James Hone

doi:10.1021/acs.nanolett.7b05161

Via Method for Lithography Free Contact and Preservation of 2D Materials

Evan J. Telford, Avishai Benyamini, Daniel Rhodes, Da Wang, Younghun Jung, Amirali Zangiabadi, Kenji Watanabe, Takashi Taniguchi, Shuang Jia, Katayun Barmak, Abhay N. Pasupathy, Cory R. Dean, James Hone.

Nano Letters 18 [2] 1416-1420. 2018.

https://doi.org/10.1021/acs.nanolett.7b05161

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2019-03-14 00:38:49 +0900 Updated at: 2026-10-30 05:47:23 +0900