Building 3D Superconductor-Based Josephson Junctions Using a via Transfer Approach

Cequn Li; Le Yi; Kalana D. Halanayake; Jessica L. Thompson; Yingdong Guan; Kenji Watanabe; Takashi Taniguchi; Zhiqiang Mao; Danielle Reifsnyder Hickey; Morteza Kayyalha; Jun Zhu; Cequn Li; Le Yi; Kalana D. Halanayake; Jessica L. Thompson; Yingdong Guan; Kenji Watanabe; Takashi Taniguchi; Zhiqiang Mao; Danielle Reifsnyder Hickey; Morteza Kayyalha; Jun Zhu

doi:10.1021/acsnanoscienceau.5c00180

Building 3D Superconductor-Based Josephson Junctions Using a via Transfer Approach

Cequn Li, Le Yi, Kalana D. Halanayake, Jessica L. Thompson, Yingdong Guan, Kenji Watanabe, Takashi Taniguchi, Zhiqiang Mao, Danielle Reifsnyder Hickey, Morteza Kayyalha, Jun Zhu.

ACS Nanoscience Au 6 [2] 216-223. 2026.

https://doi.org/10.1021/acsnanoscienceau.5c00180

Open Access American Chemical Society (ACS) (Publisher)

NIMS author(s)

Fulltext and dataset(s) on Materials Data Repository (MDR)

Created at: 2026-04-28 03:07:06 +0900 Updated at: 2026-10-03 07:08:23 +0900