Building 3D Superconductor-Based Josephson Junctions Using a via Transfer Approach

Cequn Li; Le Yi; Kalana D. Halanayake; Jessica L. Thompson; Yingdong Guan; Kenji Watanabe; Takashi Taniguchi; Zhiqiang Mao; Danielle Reifsnyder Hickey; Morteza Kayyalha; Jun Zhu; Cequn Li; Le Yi; Kalana D. Halanayake; Jessica L. Thompson; Yingdong Guan; Kenji Watanabe; Takashi Taniguchi; Zhiqiang Mao; Danielle Reifsnyder Hickey; Morteza Kayyalha; Jun Zhu

doi:10.1021/acsnanoscienceau.5c00180

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Building 3D Superconductor-Based Josephson Junctions Using a via Transfer Approach

Cequn Li, Le Yi, Kalana D. Halanayake, Jessica L. Thompson, Yingdong Guan, Kenji Watanabe, Takashi Taniguchi, Zhiqiang Mao, Danielle Reifsnyder Hickey, Morteza Kayyalha, Jun Zhu.

ACS Nanoscience Au 6 [2] 216-223. 2026.

https://doi.org/10.1021/acsnanoscienceau.5c00180

Open Access American Chemical Society (ACS) (Publisher)

NIMS著者

Materials Data Repository (MDR)上の本文・データセット

作成時刻: 2026-04-28 03:07:06 +0900 更新時刻: 2026-09-02 07:02:17 +0900