A comprehensive investigation on electronic and thermal transport properties at the Cu/diamond interface
| 著者 | Kongping Wu, Leng Zhang, Danbei Wang, Guanchao Chen, Fangzhen Li, Pengzhan Zhang, Liwen Sang, Meiyong Liao. |
|---|---|
| 掲載誌名 | Diamond and Related Materials 129 109390 ISSN: 09259635 ESIでのカテゴリ: MATERIALS SCIENCE |
| 出版社 | Elsevier BV |
| 発表年 | 2022 |
| 言語 | English |
| DOI | https://doi.org/10.1016/j.diamond.2022.109390 |
| この文献をMendeleyにインポート |  |