HOME > Article > DetailA comprehensive investigation on electronic and thermal transport properties at the Cu/diamond interfaceKongping Wu, Leng Zhang, Danbei Wang, Guanchao Chen, Fangzhen Li, Pengzhan Zhang, Liwen Sang, Meiyong Liao. Diamond and Related Materials 129 109390. 2022.https://doi.org/10.1016/j.diamond.2022.109390 NIMS author(s)LIAO, MeiyongFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2022-11-23 03:25:14 +0900 Updated at: 2026-10-08 07:07:22 +0900