HOME > 論文 > 書誌詳細Mechanism of grain structure development for pure Cu and Cu-30Zn with low stacking fault energy during FSWT. Nagira, X.C. Liu, K. Ushioda, H. Fujii. Science and Technology of Welding and Joining 25 [8] 669-678. 2020.https://doi.org/10.1080/13621718.2020.1818032 NIMS著者柳樂 知也Materials Data Repository (MDR)上の本文・データセット作成時刻: 2020-10-21 03:00:18 +0900更新時刻: 2024-03-31 10:37:39 +0900
