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Mechanism of grain structure development for pure Cu and Cu-30Zn with low stacking fault energy during FSW

T. Nagira, X.C. Liu, K. Ushioda, H. Fujii.
Science and Technology of Welding and Joining 25 [8] 669-678. 2020.
https://doi.org/10.1080/13621718.2020.1818032

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