- Address
- 305-0044 1-1 Namiki Tsukuba Ibaraki JAPAN [Access]
Accepting Students
Research
PublicationsNIMS affiliated publications since 2004.
Research papers
- Hideaki Murase, Shunto Arai, Tatsuo Hasegawa, Kazuya Miyagawa, Kazushi Kanoda. Spatiotemporal observation of quantum crystallization of electrons. Nature Communications. 14 [1] (2023) 6011 10.1038/s41467-023-41731-7 Open Access
- Shunto Arai. Advanced self-assembly control of rod-shaped organic semiconductors. Proceedings of SPIE - The International Society for Optical Engineering. 12907 (2024) 1290705 10.1117/12.3001198 Open Access
- Ryo Sakai, Shunto Arai, Takashi Hiroi, Ryota Tamate, Timothée Mouterde, Mizuki Tenjimbayashi. Reconfigurable Slippery Gradient Structure for Programmable Droplet Self-Propulsion. Langmuir. (2026) 24168-24175 10.1021/acs.langmuir.6c02822 Open Access
Books
- 荒井 俊人. 高分子溶液の乾燥過程におけるスキン層の形成と乾燥トラブル. 塗布・乾燥のトラブル対策. 技術情報協会, 2023, 7.
- 荒井 俊人. 有機半導体における多型の理解と材料開発への応用例. 晶析プロセスの設計・制御と結晶解析手法. 技術情報協会, 2025, 9.
- ARAI, Shunto. Thermodynamics and Statistics of Soft Matter. Functional Soft Matter I, Basic Principles. Springer Singapore, 2026, 21.
Proceedings
- Shunto Arai. Advanced self-assembly control of rod-shaped organic semiconductors. Emerging Liquid Crystal Technologies XIX. (2024) 10.1117/12.3001198
Presentations
- 天神林 瑞樹, 荒井 俊人. 平坦面における双安定濡れ現象. 第76回コロイドおよび界面化学討論会. 2025
- ARAI, Shunto. Durable bonding technology based on co-continuous network structures. The 9th Asia-Pacific-Rim Conference on Rheology (A-PRCR2025). 2025
- ARAI, Shunto. Interfacial structure engineering to improve adhesion strength of disparate polymers. 19th Pacific Polymer Conference (PPC19). 2025
Misc
- 荒井 俊人. 塗布型アンカー構造を利用した高耐久無機・有機接合 . FC Report. 44 [2] (2026) 59-63
- 荒井 俊人. ソフトマターの建築士を目指して. 高分子. 72 [1] (2023) 24
- 荒井 俊人. 層状有機半導体の結晶構造エンジニアリングと高性能薄膜トランジスタ. 日本化学会 有機結晶部会ニュースレター. 53 (2023) 11-12
Society memberships
応用物理学会, 日本レオロジー学会
Research Center for Macromolecules and Biomaterials
Architecting Soft Matter Structures for Advanced Functionality
Soft matter, complex fluids, self-assembly, solution-processable electronic components, Bonding technology
Overview
文字や写真を印刷するように電子・光デバイスを作製する技術はプリンテッドエレクトロニクスと呼ばれ、大規模かつ複雑化したこれまでのデバイス製造工程を格段に簡易化できると期待されている。こうしたデバイスの高性能化には有機分子やコロイドなどソフトマターと呼ばれる素材の自己組織化を理解し、制御することが求められる。これまでに、コロイド粒子・有機半導体・有機強誘電体などの配列制御に取り組み、塗布型有機トランジスタをはじめとする電子デバイスの高性能化を進めてきた。
Novelty and originality
● Developed a methodology for fabricating highly homogeneous organic semiconductor crystals.
● Fabricated sharp-switching organic transistors through dielectric/semiconductor interface design and the development of high-κ materials.
● Developed a bonding technology based on a "task-sharing" design concept.
● Developed a numerical simulation method incorporating hydrodynamic interactions.
● Developed a non-contact experimental tool to monitor the curing process of liquid coatings.
Details
（左上）高均質有機半導体層の作製。厚みが揃った分子結晶を自在に積層・パターニング。電子デバイスにも用いることができる。
（右上）異種部材接合の研究。塗って乾かすだけで多孔層を構築可能、これをテンプレートとして素材を接合。
（左下）コロイド結晶、コロイドゲルの作製と３次元観察技術。
（右下）金属ナノコロイドの作製と配線応用。
Summary
We have advanced the structural control of soft matter across a wide range of materials and scales, from fundamental interface control and bonding technologies to electronic device manufacturing. We are currently exploring applications that leverage the lightweight and flexible nature of soft matter. Furthermore, the numerical simulation methods and thin-film fabrication techniques developed in our laboratory are expected to be effective for controlling other fluid and interfacial phenomena. By exploring solution-processable materials, we will also drive the development of novel experimental and computational technologies.
