HOME > Proceedings > Detail
Homo/Heterogeneous Bonding of Cu, SiO2, and Polyimide by Low Temperature Vapor- Assisted Surface Activation Method
(150℃大気圧における銅，石英，ポリイミドの一括混載接合)
NIMS author(s)
Fulltext and dataset(s) on Materials Data Repository (MDR)
Created at: 2017-02-27 02:03:03 +0900Updated at: 2017-03-17 04:10:03 +0900