HOME > Proceedings > DetailDevelopment of a New SAB Equipment for Room Temperature Bonding(高精度常温接合のための表面活性化接合装置の開発)Matiar Howlader, Hiroyuki Shintani, Tadatomo Suga, SHIGETOU, Akitsu, Akira Yamauchi. Proceedings of the LTB-3D 469-470. 2010.NIMS author(s)SHIGETOU, AkitsuFulltext and dataset(s) on Materials Data Repository (MDR)Created at: 2017-02-27 01:48:35 +0900Updated at: 2017-03-17 03:52:55 +0900